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低温等离子体处理对竹片表面胶合性能的影响(PDF)

《南京林业大学学报(自然科学版)》[ISSN:1000-2006/CN:32-1161/S]

Issue:
2006年06期
Page:
23-26
Column:
研究论文
publishdate:
2006-06-20

Article Info:/Info

Title:
Effects of Low Temperature Plasma Treating on Bonding Strength of Bamboo Strip Surface
Article ID:
1000-2006(2006)06-0023-04
Author(s):
HUANG He-lang XUE Li-dan LU Xiao-ning DONG Li-jun
College of Wood Science and Technology Nanjing Forestry University, Nanjing 210037, China
Keywords:
Low temperature plasma Bamboo Surface wettability Bonding strength Technological parameter
Classification number :
S781
DOI:
10.3969/j.jssn.1000-2006.2006.06.005
Document Code:
A
Abstract:
The treatment of low temperature plasma to the surface of bamboo strips with or without hypodermis can improve the surface wettability and bonding strength of bamboo strips. In this research, treating time, treating distance and treating electrical power of low temperature plasma are investigated. The results show that the treating distance is the strongest affecting factor, followed by treating time and treating electrical power. The optimum technological parameters are as follows: treating time is 5s, treating distance is 10mm, treating electrical power is 650W. Under this treatment condition, bonding shearing strength of the bamboo strips with hypodermics increased by 143.9% with its key coefficient variance (CV) decreasing by 11.9%. Bonding shearing strength of the bamboo strips without hypodermis increased by 45.8% while its key coefficient variance (CV) decreasing by 6.5%.

References

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Last Update: 2013-05-20