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淀粉基水性异氰酸酯木材胶黏剂老化机理研究(PDF)

《南京林业大学学报(自然科学版)》[ISSN:1000-2006/CN:32-1161/S]

Issue:
2010年02期
Page:
81-84
Column:
研究论文
publishdate:
2010-03-30

Article Info:/Info

Title:
Retrogress mechanism of starchbased aqueous polymer isocyanate adhesive
Author(s):
SHI Junyou12 WANG Yao1
1.Department of Wood Science and Engineering, Beihua University, Jilin 132013, China; 2.Department of Chemical Engineering, Tsinghua University, Beijing 100084, China
Keywords:
starchbased aqueous polymer isocyanate adhesive retrogress mechanism
Classification number :
TQ352
DOI:
10.3969/j.jssn.1000-2006.2010.02.019
Document Code:
A
Abstract:
Starchbased aqueous polymer isocyanate adhesive was used to bond the structural laminated lumber. Then it was retrogressed accelerative by boiling treatment. The chemical and physical changes in the aging process were analyzed by means of Raman, 13C-NMR and GPC to reveal the retrogress mechanism. The results showed that the reaction of -NCO group occurred in the bonding film in the process of retrogress, i.e., the amine compounded firstly and then decompounded. But there was no change in the modified starch linked to the polymer isocyanate (PMDI). After the accelerated retrogression, the chains of polyvinyl alcohol (PVA) in the adhesive were cut into small molecules dissolving in water. Other components did not dissolve or degrade.

References

[1]时君友. 淀粉基API木材胶黏剂及其固化与老化机理研究[D]. 哈尔滨:东北林业大学,2007.
[2]时君友,韦双颖. 水性改性淀粉—多异氰酸酯胶黏剂的研究[J]. 林业科学,2003,39(5):105-110.
[3]时君友,顾继友,涂怀刚,等. 复合变性淀粉制备淀粉基异氰酸酯胶黏剂的研究[J]. 林产化学与工业,2008,28(5):77-83.
[4]张新申. 高效液相色谱分析[M]. 北京:科学出版社,1985.
[5]Deneve B, Delamr M, Nguyen T T, et al. Failure mode and ageing of steelepoxy joints[J]. Applied Surface Science 1998, 134: 202-212.
[6]ZanniDeffarges M P, Shanahan M E R. Diffusion of water into an epoxy adhesivecomparison between bulk behavior and adhesive joints[J]. Int J of Adhesion and Adhesives, 1995, 15: 137-142.
[7]Ivanova K I, Pethrick R A, Affrossman S. Investigation of mechanical thermal analysis and dielectric spectroscopy[J]. Polymer, 2000, 41: 6 787-6 796.
[8]Liu J, Gustafsson K, Lai Z, et al. Surface characteristics, reliability, and failure mechanisms of tin/lead, copper, and gold metallizations[J]. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 1997, 20: 21-30.

Last Update: 2010-05-14