豆胶胶合板的高频热压机理及胶合特性

李文定; 王超; 张洋; 高鹏; 李珊珊; 高晨超

doi:10.3969/j.issn.1000-2006.2014.03.023

豆胶胶合板的高频热压机理及胶合特性

李文定,王超,张洋,高鹏,李珊珊,高晨超

南京林业大学学报（自然科学版） ›› 2014, Vol. 38 ›› Issue (03) : 120-124.

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南京林业大学学报（自然科学版） ›› 2014, Vol. 38 ›› Issue (03) : 120-124. DOI: 10.3969/j.issn.1000-2006.2014.03.023

研究论文

豆胶胶合板的高频热压机理及胶合特性

李文定¹,王超¹,张洋^1*,高鹏²,李珊珊¹,高晨超¹

作者信息 +

Hot-pressing mechanism and bonding characteristics of soy protein adhesive plywood under radio-frequency heating

LI Wending¹, WANG Chao¹, ZHANG Yang^1*, GAO Peng², LI Shanshan¹, GAO Chenchao¹

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文章历史 +

摘要

采用高频介质加热技术,研究了不同含水率条件下的多层豆胶胶合板板坯温度场分布和水分迁移情况,以及单板涂胶量对豆胶胶合板胶合性能的影响。结果表明:在高频热压(频率为6.78 MHz,压力为1.0 MPa)过程中,板坯内部温度场分布均匀; 干燥效率呈现出从表层向芯层逐渐增加,即由里到外的干燥模式; 当单板双面涂胶量为400 g/m²时,胶层平均湿态剪切强度为0.83 MPa,高频热压时间仅为12 min。

Abstract

The distribution of temperature field and moisture migration in the mats with different moisture content through radio-frequency(RF)heating and pressing was investigated in this work, the influence of gluing content of soyprotein adhesive(SPA)on the bonding characteristics of plywood was also examined. The results showed that the mats had a uniformly distribution of temperature field during the RF heating at 6.78 MHz and pressing at 1.0 MPa. The RF drying efficiency increased towards the center of the mats, creating the typical drying pattern from inside to outside. When the glue spread amount(two faces)of veneer was 400 g/m², the wet shear strength of plywood was 0.83 MPa and the working time was just 12 min.

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李文定,王超,张洋,高鹏,李珊珊,高晨超. 豆胶胶合板的高频热压机理及胶合特性[J]. 南京林业大学学报（自然科学版）. 2014, 38(03): 120-124 https://doi.org/10.3969/j.issn.1000-2006.2014.03.023

LI Wending, WANG Chao, ZHANG Yang, GAO Peng, LI Shanshan, GAO Chenchao. Hot-pressing mechanism and bonding characteristics of soy protein adhesive plywood under radio-frequency heating[J]. JOURNAL OF NANJING FORESTRY UNIVERSITY. 2014, 38(03): 120-124 https://doi.org/10.3969/j.issn.1000-2006.2014.03.023

中图分类号： S784 TQ433

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基金

收稿日期:2013-10-17 修回日期:2014-02-25
基金项目:高校科研成果产业化推进工程项目(JH10-15); 苏北科技富民强县项目(BN2009011); 江苏省科技型企业技术创新资金项目(BC2013422)
第一作者:李文定,博士生。*通信作者:张洋,教授。E-mail: yangzhang31@126.com。
引文格式:李文定,王超,张洋,等. 豆胶胶合板的高频热压机理及胶合特性[J]. 南京林业大学学报:自然科学版,2014,38(3):120-124.