为实现对指接材端压范围的预测,采用ANSYS有限元分析软件模拟分析了樟子松结构用指接材3种嵌合度条件下的指接端压范围。结果表明:当指榫嵌合度为0、0.1、0.3 mm时,模拟分析得出的樟子松结构用指接材指接端压范围分别为1.5～3.0 MPa、2.0～3.5 MPa和2.5～4.5 MPa。将实验测试结果与模拟分析结果对比发现,模拟分析得出的指接端压范围相对试验测试结果小,但可以用于预测樟子松结构用指接材最佳端压取值。模拟分析与实验测试结果均表明,樟子松结构用指接材端压最佳取值为3.5 MPa。
Abstract
By using the software of ANSYS for finite element analysis, the end-pressure range of Pinus sylvestris L. finger jointed lumber for structural use under three different fitness ratio were modeled. According to the modeling results, the end-pressure range were 1.5-3.0 MPa, 2.0-3.5 MPa and 2.5-4.5 MPa respectively when the fitness ratio are 0, 0.1 and 0.3 mm. Comparing the modeling results with the experimental results, it indicated that the end-pressure range from the modeling result was narrower than that of the experimental results. Therefore, the modeling can be used to predict the optimum end-pressure for finger jointed lumber, which showed that the optimal value of Pinus Sylvestris L. finger jointed lumber for structural was 3.5 MPa.
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参考文献
[1] 林兰英,傅峰.指接材研究现状与进展[J].木材工业,2007,21(4):5-8.
Lin L Y, Fu F. Research status and development trends of finger-jointed lumber[J]. China Wood Industry, 2007,21(4):5-8.
[2] 林兰英,傅峰.短榫指接端压和嵌合度参数分析[J].北京林业大学学报,2008,30(2):138-142.
Lin L Y, Fu F. Endpressure and fitness ratio for mini-finger jointing[J]. Journal of Beijing Forestry University, 2008,30(2):138-142.
[3] 堀江秀夫,倉田久敬.フインガジョイント材(F.J材)の强度性能[J].林産试研报,1983(72):14-16.
Hideo H, Kurata Y. Properties of finger-jointed lumber[J].Report of Forest Product Research,1983(72):14-16.
[4] 堀江秀夫,倉田久敬. 构造用フインガジョイント材の强度性能[J].林産试研报,1984(73):1-34.
Hideo H, Kurata Y. Properties of finger-jointed lumber[J].Report of Forest Product Research,1984(73):1-34.
[5] 堀江秀夫,倉田久敬.フインガジョイント材(F.J材)の强度性能[J].林産试研报,1982(71):1-7.
Hideo H, Kurata Y. Properties of finger-jointed lumber[J].Report of Forest Product Research, 1982(71):1-7.
[6] 梁善庆,蔡智勇,王喜平,等.北美木材无损检测技术的研究与应用[J].木材工业,2008,22(3):5-8.
Liang S Q, Cai Z Y, Wang X P, et al. Developments and applications of nondestructive tests for wood in north America[J]. China Wood Industry, 2008,22(3):5-8.
[7] 林兰英,傅峰.三种无损检测方法预测四种桉树木材弹性模量的对比研究[J].木材加工机械,2007,18(3):24-29.
Lin L Y, Fu F. Comparative study of MOE on three methods of nondestructive test forecasting four kinds of lumber[J]. Wood Processing Machinery, 2007,18(3):24-29.
[8] 张厚江,申世杰,崔英颖,等.振动方式测定木材弹性模量[J].北京林业大学学报,2005,27(6):91-94.
Zhang H J, Shen S J, Cui Y Y, et al. Measuring elastic modulus of wood using vibration method[J]. Jounal of Beijing Forestry University, 2005,27(6):91-94.
[9] 赵荣军,霍小梅,张黎.利用近红外光谱技术预测粗皮桉木材弹性模量[J].光谱学与光谱分析,2009(9):2392-2395.
Zhao R J, Huo X M, Zhang L. Estimation of modulus of elasticity of eucalyptus pellita wood by near infrared spectroscopy[J]. Spectroscopy and Spectral Analysis, 2009(9):2392-2395.
[10] Tabiei A, Wu J.Three-dimensional nonlinear orthotropic finite element material model for wood[J]. Composite Structures, 2000,50:143-149.
[11] Moses D M, Prion H G L. Stress and failure analysis of wood composites: a new model[J].Composites: Part B, 2004, 35: 251-261.
[12] Serrano E. A numerical study of the shear-strength-predicting capabilities of test specimens for wood adhesive bonds[J]. International Journal of Adhesion & Adhesives, 2004, 24: 23-35.
[13] Davalos J F, Kim Y Ch. A layerwise beam element for analysis of frames with laminated sections and flexible joints[J].Finite Elements in Analysis and Design,1995, 19: 181-194.
[14] Jas Maff, Notification No.590. Finger Jointed Structural Lumber for Wood Frame Platform Construction[S].Japan:Japan Plywood Inspection Corporation.
[15] 何盛. 樟子松指接材有限元模型分析研究[D].南京:南京林业大学,2011.
He S. Study of finite element modeling analysis for Pinus sylvestris L. var. mongolica Litv. finger-jointed lumber[D]. Nanjing: Nanjing Forestry University, 2011.
[16] 何盛,林兰英,傅峰,等. 樟子松指接材抗弯强度有限元模拟分析[J]. 林业科学, 2012,48(11):63-68.
He S, Lin L Y, Fu F, et al. Finite element analysis of bending strength for Pinus sylvestris var. mongolica finger-jointed lumber[J]. Scientia Silvae Sinicae, 2012,48(11):63-68.
基金
收稿日期:2013-05-09 修回日期:2013-12-06
基金项目:“十二五”国家科技支撑计划(2012BAD24B02)
第一作者:何盛,博士生。*通信作者:林兰英,助理研究员,博士。E-mail: linly@caf.ac.cn。
引文格式:何盛,林兰英,傅峰,等. 指接材端压有限元的模拟分析[J]. 南京林业大学学报:自然科学版,2014,38(2):16-20.
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